We set a simple goal: to answer most of the questions that you have for free, in a reliable and simple language.
Main page
BUILDING
Produce manufacturing electronic devices, except integrated circuits and piezoelectric devices

Produce manufacturing electronic devices, except integrated circuits and piezoelectric devices

Electronic gadgets have become an integral part of our lives. They have made our lives more comfortable and convenient. From aviation to medical and healthcare industries, electronic gadgets have a wide range of applications in the modern world. In fact, the electronics revolution and the computer revolution go hand in hand. Most gadgets have tiny electronic circuits that can control machines and process information.

VIDEO ON THE TOPIC: Lec 15 IC Fabrication Process

Dear readers! Our articles talk about typical ways to resolve Produce manufacturing electronic devices, except integrated circuits and piezoelectric devices, but each case is unique.

If you want to know, how to solve your particular problem - contact the online consultant form on the right or call the numbers on the website. It is fast and free!

Content:

Electronic integrated circuits: UK manufacturer sales 2008-2018

The present invention relates to a piezoelectric or voltage-controlled oscillator having a semiconductor integrated circuit and a piezoelectric resonator. The present invention relates to a method of producing the piezoelectric or voltage-controlled oscillator.

In recent years, great reductions in size and weight have been achieved in various information equipment including HDDs hard disk drive , portable computers and mobile communication systems such as portable or mobile telephones. As a result, the size and thickness of piezoelectric and voltage-controlled oscillators for use in these devices must be reduced.

Thus, there is a need for piezoelectric and voltage-controlled oscillators of a surface mounting type that can be mounted on either surface of a circuit board. In the conventional quartz-crystal oscillator shown in FIGS. A quartz-crystal resonator is fixed to inner leads As shown in FIG. The quartz-crystal resonator is electrically connected to the gate electrode and the drain electrode of the IC chip In the conventional voltage-controlled oscillator shown in FIGS.

A quartz-crystal resonator is also mounted on the substrate The can is hermetically sealed by resistance welding for example. In another common type, a trimmer capacitor or the like is provided on the substrate and an adjusting hole is formed in the can so that the frequency may be adjusted after the voltage-controlled oscillator is mounted on a circuit board installed in a device such as a mobile communication system.

In the conventional piezoelectric and voltage-controlled oscillators described above, the piezoelectric resonator is accommodated in a cylinder case having a diameter of about 3 mm. As a result, the piezoelectric or voltage-controlled oscillator has a large height such as about 4.

Thus, its total volume is as great as 0. To reduce the thickness of the plastic-molded piezoelectric or voltage-controlled oscillator, the thickness of the piezoelectric resonator must be reduced. There are two known techniques for this purpose. A first technique is to use a piezoelectric element having a smaller size and dispose it in a cylinder case having a smaller diameter. If the diameter of the piezoelectric resonator is reduced to 1. However, there is difficulty in designing and producing a piezoelectric element such as a quartz chip having such a small size while maintaining the required performance.

This technique is therefore expensive and impractical. A second technique is to reduce the thickness by forming the cross-section of the piezoelectric resonator into an elliptical shape or a track shape combination of a rectangle and two semicircles.

In this technique, the piezoelectric element disposed in the case is allowed to have a size similar to that of the conventional piezoelectric element. Therefore, it is possible to produce a piezoelectric element without increasing the cost.

An example of a piezoelectric oscillator produced using the second technique is disclosed in Japanese Patent Laid-Open No. In this example, the small-sized oscillator employs a piezoelectric resonator whose cross-section is flat at one end. When a piezoelectric or voltage-controlled oscillator is molded with resin, projection pressure is uniformly imposed on the piezoelectric resonator and semiconductor integrated circuit disposed in the oscillator.

A hollow case is used with the piezoelectric element disposed therein. Therefore, the case has mechanical strength strong enough not to be deformed by pressure during the molding process so that the piezoelectric element does not come into contact with the inner walls of the case and no strain occurs either in the piezoelectric element or in the mounting part.

Deformation also depends on the shape of the piezoelectric resonator. Computer simulation using structure analysis software has revealed that when using a piezoelectric resonator having an elliptic or track-like cross-section, non-uniform deformation is induced by uniform pressure arising during the molding process. Greater deformation occurs in parts of the case parallel to the major axis of the ellipse or in linear parts of the track shape compared to the cylinder type in which deformation occurs uniformly.

Similar results have been observed in experiments on the effects of molding. Deformation of the case caused by the shrinkage of the molding resin also depends on the location at which the piezoelectric resonator is disposed in the piezoelectric or voltage-controlled oscillator.

That is, when the molding resin shrinks and thermal stress occurs in the molding resin, thermal stress varies from part to part of the piezoelectric or voltage-controlled oscillator. Therefore, the location of the piezoelectric resonator and structure of the piezoelectric or voltage-controlled oscillator must be optimized.

The piezoelectric resonator and the IC chip are then disposed and molded in a substantially central part of a piezoelectric oscillator with a resin. However, the area of the flat part must be greater than the area of the IC in order to attach the IC on the flat part of the piezoelectric resonator. Therefore, the area of the flat part must be increased with an increase in the size of the IC chip.

To increase the area of the flat part of the piezoelectric resonator, the length of the linear part of the track shape must also be increased. This results in an increase in the pressure applied to the piezoelectric resonator during molding which in turn increases the deformation of the case. Since the thickness of the resin disposed on the piezoelectric resonator is greater near the IC chip than in an opposite part, the part near the IC chip has greater deformation compared to the opposite part.

As described above, to achieve a reduction in the thickness of a piezoelectric or voltage-controlled oscillator employing a piezoelectric resonator having an elliptic or track-like cross-section, the shape of the cross-section of the piezoelectric resonator and the position at which the piezoelectric resonator is disposed must be optimized.

There is also a need for higher accuracy in the oscillation frequency of piezoelectric and voltage-controlled oscillators. It is an object of the present invention to solve the above problems. More specifically, it is an object of the present invention to provide high-accuracy piezoelectric and voltage-controlled oscillators having a small size and thickness at a low cost.

In a first embodiment, a piezoelectric oscillator includes a semiconductor integrated circuit and a piezoelectric resonator. The semiconductor integrated circuit is mounted on an island of a lead frame. The semiconductor integrated circuit is electrically connected to an inner lead of the lead frame by a wire-bonded wire.

The piezoelectric resonator has an elliptic cross-sectional shape or a track cross-sectional shape and is disposed adjacent to the semiconductor integrated circuit. A lead of the piezoelectric resonator is electrically connected to part of the lead frame. A signal input lead terminal is electrically connected to the semiconductor integrated circuit so that data in the semiconductor integrated circuit is controlled by the signal input lead terminal. The semiconductor integrated circuit, piezoelectric resonator and lead frame are molded with a resin into a single unit such that the outer part of the inner lead electrode and the signal input lead terminal are exposed to the outside.

The oscillation frequency is adjusted by applying a signal to the piezoelectric oscillator by the signal input lead terminal. In a second embodiment, the piezoelectric oscillator is molded with resin such that the thickness of the resin is disposed on the upper side of the piezoelectric resonator in an equal amount to that on the lower side of the piezoelectric resonator.

In a third embodiment, a surface of the piezoelectric resonator case is exposed to the outside of the piezoelectric oscillator. In a fourth embodiment, portions along a major axis of the ellipse of the piezoelectric resonator case have a greater thickness in cross-section than other portions of the case.

In a similar embodiment, portions along linear portions of the piezoelectric resonator case of the track shape have a greater thickness in cross-section than other portions of the case. In a sixth embodiment, the lead frame is provided with a supporting lead terminal for supporting the piezoelectric oscillator molded with the resin into the single unit. In a seventh embodiment, the signal input lead terminals used to control the data in the semiconductor integrated circuit are disposed in a line parallel to the piezoelectric resonator at side locations of the semiconductor integrated circuit opposite the piezoelectric resonator.

In a tenth embodiment, a method is provided for producing a piezoelectric oscillator including the steps of: mounting a semiconductor integrated circuit on an island of a lead frame and performing wire-bonding so that the semiconductor integrated circuit is electrically connected to an inner lead electrode of the lead frame; and positioning a piezoelectric resonator on the lead frame so that the piezoelectric resonator is disposed adjacent to the semiconductor integrated circuit.

The lead of the piezoelectric resonator is then electrically connected to a part of the lead frame. Tie-bars are cut off connecting the outer part of the inner lead and the signal input lead terminal. A signal is applied to the input lead terminal to adjust the oscillation frequency. The outer part of the inner lead electrode is bent and the signal input lead terminal and the supporting lead terminal are cut to thereby separate the piezoelectric oscillator from the lead frame.

In an eleventh embodiment, data is applied by the signal input lead terminal and NC terminal or OE terminal in the applying step. In a twelfth embodiment, the frequency is adjusted for a plurality of piezoelectric oscillators remaining connected to the lead frame in the applying step. In a thirteenth embodiment, a voltage-controlled oscillator is provided including a semiconductor integrated circuit, a piezoelectric resonator and another electronic component.

The semiconductor integrated circuit is mounted on an island of a lead frame and is electrically connected to an inner lead of the lead frame by a wire-bonded wire. The piezoelectric resonator having an elliptic cross-sectional shape or a track cross-sectional shape combination of a rectangle and two semicircles is adjacent to the semiconductor integrated circuit.

A lead of the piezoelectric resonator is electrically connected to a part of the lead frame. The electronic component is mounted on a land of the lead frame. The semiconductor integrated circuit, the piezoelectric resonator, the electronic component and the lead frame are molded with a resin into a single unit such that the outer part of the inner lead electrode and the signal input lead terminal are exposed to the outside.

The oscillation frequency is adjusted by applying a Signal to the piezoelectric oscillator by the signal input lead terminal. In a fourteenth embodiment, the voltage-controlled oscillator is molded with resin such that the thickness of the resin disposed on the upper side of the piezoelectric resonator is equal to that on the lower side of the piezoelectric resonator.

In a fifteenth embodiment, a surface of the piezoelectric resonator case is exposed to the outside of the voltage-controlled oscillator. In a sixteenth embodiment, portions along a major axis of the ellipse of the piezoelectric resonator case have a greater thickness in cross-section than other portions of the case. In an eighteenth embodiment, the lead frame is provided with a supporting lead terminal for supporting the voltage-controlled oscillator molded with the resin into the single unit.

In a nineteenth embodiment, the signal input lead terminals used to control the data in the semiconductor integrated circuit are disposed in a parallel line to the piezoelectric resonator at side locations of the semiconductor integrated circuit opposite the piezoelectric resonator.

In a twenty-third embodiment, a method is provided for producing a voltage-controlled oscillator including the steps of: mounting a semiconductor integrated circuit on an island of a lead frame and performing wire-bonding so that the semiconductor integrated circuit is electrically connected to an inner lead electrode of the lead frame by a wire-bonded wire. A piezoelectric resonator is positioned on the lead frame so that the piezoelectric resonator is disposed adjacent to the semiconductor integrated circuit.

The electronic component is mounted on a land formed in the lead frame. The semiconductor integrated circuit, piezoelectric resonator, electronic component and the lead frame are molded with a resin into a single unit such that the outer part of the inner lead electrode and the signal input lead terminal are exposed to the outside. Tie-bars are cut off that were connecting the outer part of the inner lead and the signal input lead terminal.

The outer part of the inner lead electrode is bent. The signal input lead terminal and the supporting lead terminal are cut to separate the voltage-controlled oscillator from the lead frame. In a twenty-fourth embodiment, data is applied by the signal input lead terminal and VC terminal to adjust the oscillation frequency.

In a twenty-fifth embodiment, the frequency is adjusted for a plurality of voltage-controlled oscillators remaining connected to the lead frame.

In a twenty-sixth embodiment, the piezoelectric resonator and the variable-capacitance diode are connected in series between the input and output terminals of an inverter of the semiconductor integrated circuit. A DC-cutting capacitor is located between the variable-capacitance diode and the inverter.

The node between the piezoelectric resonator and the variable-capacitance diode is connected to ground by a bias resistor. A signal is then applied to the node between the variable-capacitance diode and the DC-cutting capacitor. Other objects, advantages and salient features of the invention will become apparent from the detailed description taken in conjunction with the annexed drawings, which disclose preferred embodiment of the invention.

The invention will be described with reference to the following drawings in which like reference numerals refer to like elements and wherein:. A quartz-crystal or voltage-controlled oscillator includes a quartz-crystal resonator serving as the piezoelectric resonator accommodated in a plastic package of a SOJ small outline J-lead type are used below as examples.

These examples are for the purposes of illustration and are not intended to be limiting of the invention. A great part of the voltage-controlled oscillator is the same as the quartz-crystal oscillator.

Therefore, the common parts will only be described with reference to the quartz-crystal oscillator so that no duplicated description is necessary.

Energy harvesting for the implantable biomedical devices: issues and challenges

Digital Ic Kit. Digital Circuits. Proteus Discover is a Digital Medicine offering that measures medication treatment effectiveness and helps physicians improve clinical outcomes. Ham Radio Outlet Plano, Texas.

Metrics details. The development of implanted devices is essential because of their direct effect on the lives and safety of humanity.

Since , System Plus Consulting engineers have been analyzing and modeling the production cost and selling price of integrated circuits, electronic boards and systems. Broadcom and Qorvo are the major thin-film players in the RF 4 filters arena. Such technologies are indeed able to work with ultra-low power. Bulk piezo devices offer the high actuation performance that is expected in a number of applications, from inkjet printheads to linear motors achieving very precise movements.

NAICS Code 334419 – Other Electronic Component Manufacturing

The present invention relates to a piezoelectric or voltage-controlled oscillator having a semiconductor integrated circuit and a piezoelectric resonator. The present invention relates to a method of producing the piezoelectric or voltage-controlled oscillator. In recent years, great reductions in size and weight have been achieved in various information equipment including HDDs hard disk drive , portable computers and mobile communication systems such as portable or mobile telephones. As a result, the size and thickness of piezoelectric and voltage-controlled oscillators for use in these devices must be reduced. Thus, there is a need for piezoelectric and voltage-controlled oscillators of a surface mounting type that can be mounted on either surface of a circuit board. In the conventional quartz-crystal oscillator shown in FIGS. A quartz-crystal resonator is fixed to inner leads As shown in FIG.

Accelerometer Ic

Electronic devices have become ubiquitous in modern society and are prevalent in every facet of human activities. Although electronic devices have brought much convenience and value, the insatiable appetite for newer and more attractive devices has also created a growing ecological problem: managing electronic waste or e-waste. As the lifetime of electronic devices gets shorter and shorter, the pressure on e-waste management systems is mounting with no abate in sight. Therefore, an alternative to traditional electronics must be sought.

Dc Buzzer Circuit. The person you want is usually in a different room, such as the hobby room or bedroom.

Industry-specific and extensively researched technical data partially from exclusive partnerships. A paid subscription is required for full access. You need a Premium Account for unlimited access. Additional Information.

Pressure Sensor Ic

In the " Catalogue for the Guidance of Foreign Invested Enterprises " there are the industries listed which are restricted or prohibited for investment. Because this catalogue is updated on a regular basis, it is advised to consult before considering any investment. Planting, development and production of woody plants that contain edible oil or are used as seasonings or industrial raw materials.

Electrostatic discharge Electrostaticdischarge. ESD is a big harm for electronic equipment applications. The main performance is electrostatic discharge can cause damage to integrated circuits, piezoelectric devices, film resistors, thin films, and thick film solid state devices in electronic devices,thus increasing the maintenance cost of electronic devices and prolonging the maintenance time, thereby reducing the use of electronic devices. Electrostatic damage to optical transmission equipment has four characteristics:. Related Tags : static electricity optical transceiver optical module. Talking about the influence and characteristics of static electricity on optical transmission equipment.

How Electronic Components Work

Three-dimensional 3D printing now enables the fabrication of novel 3D structural electronics and microfluidics. However, conventional subtractive manufacturing processes for MEMS fabrication relatively limit device structure to two dimensions and require post-processing steps for interface with microfluidics. Thus, the objective of this work is to create an additive manufacturing approach for fabrication of 3D microfluidic-based MEMS devices that enables 3D configurations of electromechanical systems and simultaneous integration of microfluidics in a one-pot manufacturing process. Here, we demonstrate the ability to fabricate microfluidic-based 3D microelectromechanical systems MEMS that contain orthogonal out-of-plane piezoelectric sensors and actuators using additive manufacturing. The devices were fabricated using a microextrusion 3D printing system that contained integrated pick-and-place functionality.

To do this, they incorporate into a circuit a piezoelectric element that converts movements have long been using piezoelectric devices to harvest energy in everything. has the equipment and experience to manufacture piezoelectric elements in almost 5mm Passive Electronic Piezoelectric Piezo Buzzer-G ksNM: $5.

There are various basic electrical and electronic components which are commonly found in different circuits of peripherals. Active components are nothing but the components that supply and control energy. These components can be found in numerous peripherals like hard disks, mother boards, etc.

Digital Ic Kit

Piezo Element. The post explains how you can make a simple buzzer circuit using a 27mm piezo element and a small BC transistor circuit. Global footprint: 1. Competitive prices from the leading Piezo Transducer Elements distributor.

Electrical and Electronic Components in Electronics and Electrical Projects

Because crystal devices such as quartz crystal units and quartz crystal oscillators have high stability against an environment change such as temperature, they are used as frequency control devices in electronic circuits. From smartphones, digital still cameras, automobiles, medical devices, to Ubiquitous Network, the product category for crystal devices are becoming wider. Of precious stones, crystals are relatively familiar. They are used in traditional crafts, jewelry, and even mystical crystal balls.

What are some examples of this code?

As most tilt data entry applications can be. Following are the benefits or advantages of Accelerometer sensor: It is simple to interface and rugged in design. Such MEMS systems are used in three different planes x, y, z of accelerometer IC to determine acceleration in different directions of the body. Accelerometers Accelerometers Murata is the global market leader in low-g acceleration sensors for automotive applications.

A Closer Look at Quartz Crystal Components

Стратмор пожал плечами. - Слабое сердце… да к тому же еще испанская жара. Не забывай и о сильнейшем стрессе, связанном с попыткой шантажировать наше агентство… Сьюзан замолчала. Какими бы ни были обстоятельства, она почувствовала боль от потери талантливого коллеги-криптографа. Мрачный голос Стратмора вывел ее из задумчивости.

Сьюзан посмотрела на него и подумала о том, как жаль, что этот человек, талантливый и очень ценный для АНБ, не понимает важности дела, которым занимается агентство.

- Грег, - сказала она, и голос ее зазвучал мягче, хотя далось ей это нелегко.  - Сегодня я не в духе.

Comments 0
Thanks! Your comment will appear after verification.
Add a comment

  1. Meramar

    What amusing topic